What is the assembly of PoP elements?

Package on Package (PoP) technology was born in the early 1990s. The era of hardware miniaturization began, which required better use of the available PCB surfaces. Manufacturers more and more often started to use 3D casings, in which several structures could be placed directly on top of each other. The development of this technology gave rise to small mobile devices with huge computing power.

Installation of PoP - basic principles of operation

The key factor influencing the efficient and fast operation of an electronic device is the combination of the processor and memory. Longer connections result in a longer cycle time for reading and writing logic signals. The PoP installation allowed to effectively limit the length of connections between the processor and memory. All thanks to the innovative multi-storey assembly system.

Package on Package technology implies a direct superimposition of a memory module on a processor module. The advancing era of miniaturization allows a small space to tightly compact the components that affect the processing power of the processor and memory capacity. 

The PoP circuit greatly shortens the distance between the processor and memory, thanks to which the computing processes take place much faster. Thus, we owe ever faster computers and mobile devices to PoP technology.

What are the advantages of PoP technology?

PoP systems turn out to be much more efficient than conventional SO, PLCC and QFP systems. With the help of stacking, it is possible to obtain a higher speed of operation of the systems while reducing the energy needed to operate the device. At the same time, in the PoP system, we are able to apply different types of memory to the same processor. Stacking connections also allowed to reduce the temperature of connections between the processor and memory.

The result is small mobile devices that have enormous computing power. Currently, small smartphones can match large desktop computers in this respect. At the beginning of the 21st century, it was hard to imagine that in just two decades each of us would be able to carry an extremely powerful multimedia device with unlimited possibilities in our pockets.

What are the limitations of PoP technology?

Of course, creating advanced PoP systems requires modern technology and automated PCB assembly processes. This forced further development of technology related to soldering and securing subsequent components. The main limitation within PoP systems is the much more difficult quality control.

With conventional systems, a simple optical inspection is sufficient to identify any imperfections on the board surface. PoP systems are built of several layers superimposed on top of each other, and therefore more modern quality control technologies are needed. High concentration of components in a small space also increases the risk of short circuits and mechanical damage, which usually translates into a shorter life of modern equipment.



DFT (Design for Testing) analysis is used in the process of designing and manufacturing electronics circuits. Some of integrated circuits are equipped with additional ...
Wave soldering with using hot nitrogen is a relatively young process that was introduced about 20 years ago. Initially, manufacturers rarely used this method. Today,...
Using rectangular apertures for round BGA pads or designing four corner pads can lead to a disaster.
Harmful properties of lead have been known for years. This element is not only hazardous to our health but also poses some problems as far as ...