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Two different wireless protocols can - and sometimes must - work together in a single smart home system.
One of the basic challenges related to electronics housings is heat dissipation, which is related to the heating of electrical, and thus mechanical elements inside the housings.
Printing solder paste for very small components, such as CSP with a pin spacing of 0.3 mm or components in chip 01005 housings, is a key challenge in the printing process.
What are the likely causes of the common problem of solder spatter formation during wave soldering, and how can I prevent them?